Specifications
Power
| Power Envelope | 15–75 W |
|---|
Memory
| Memory | 64 GB |
|---|---|
| Memory Type | LPDDR5 |
| Memory Bandwidth (GB/s) | 204.8 |
Compute
| CPU Cores | 12 |
|---|---|
| Tensor Cores | 64 |
| NVDLA Engines | 2 |
| GPU CUDA Cores | 2,048 |
| GPU Architecture | Ampere |
Thermal
| Module Max TTP Temperature | 85 °C |
|---|
Identity
| Device Type | System-on-Module |
|---|---|
| Jetson Family | Jetson AGX Orin |
Mechanical
| Form Factor | 699-pin B2B (100x87mm) |
|---|
Performance
| Max AI Performance (TOPS) | 248 TOPS |
|---|---|
| Max FP32 TFLOPS | 4.8 TFLOPS |
Category: NVIDIA / NVIDIA Hardware / Production Modules
Questions about this product
- 3U VPX board for Jetson AGX Orin Industrial with the lowest max power consumption
- AGX Orin family production module with the highest max power and its TTP limit
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- Carrier boards and VPX boards aimed at rugged military applications
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- EIZO Rugged Solutions VPX boards that list MIL-STD-461
- EN50155-certified AGX Orin Industrial box PC with GMSL inputs and -40°C operation
- Interface card or camera kit with the most GMSL inputs for AGX Orin
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- Jetson modules with more than two NVDLA engines
- Jetson Orin modules without DLA engines
- Jetson production modules rated for an 85 °C max TTP temperature
- Jetson production modules with 12 or more CPU cores
- Jetson production modules with 64 or more Tensor Cores
- Jetson production modules with more than 128 GB of memory
- Jetson production modules with the 699-pin B2B (100x87mm) connector
- Lightest AGX Orin Industrial carrier board for a UAV payload
- Lowest-power NVIDIA module with at least 64 GB of memory
- Neousys NRU-230V-AWP vs NRU-51V+ / NRU-51V: temperature, GMSL and Jetson modules
- NVIDIA modules whose max power envelope goes above 130 W
- NVIDIA production module with the highest FP32 TFLOPS
- Other vendors' box PCs supporting AGX Orin Industrial rated to -40°C
- Production modules with more than 200 GB/s of memory bandwidth
- WOLF Advanced Technology VPX boards with 100GbE