Specifications
Power
| Power Envelope | 10–30 W |
|---|
Memory
| Memory | 32 GB |
|---|---|
| Memory Type | LPDDR4x |
| Memory Bandwidth (GB/s) | 136.5 |
Compute
| CPU Cores | 8 |
|---|---|
| Tensor Cores | 64 |
| NVDLA Engines | 2 |
| GPU CUDA Cores | 512 |
| GPU Architecture | Volta |
Thermal
| Module Max TTP Temperature | 80 °C |
|---|
Identity
| Device Type | System-on-Module |
|---|---|
| Jetson Family | Jetson AGX Xavier |
Mechanical
| Form Factor | 699-pin B2B (100x87mm) |
|---|
Performance
| Max AI Performance (TOPS) | 32 TOPS |
|---|---|
| Max FP32 TFLOPS | 1.41 TFLOPS |
Category: NVIDIA / NVIDIA Hardware / Production Modules
Questions about this product
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- Box PCs with a 3.5-inch drive bay for bulk video storage
- Forecr MILBOARD-AGX supported module with the most INT8 TOPS and its power envelope
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- Jetson module with the most CPU cores within a 25 W power cap
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- Jetson modules with more than two NVDLA engines
- Jetson production modules already marked EOL in a supply-chain review
- Jetson production modules with 64 or more Tensor Cores
- Jetson production modules with a Volta GPU
- Jetson production modules with at least 32 GB memory and max power of 40 W or less
- Jetson production modules with exactly 8 CPU cores
- Jetson production modules with the 699-pin B2B (100x87mm) connector
- Module with 2 NVDLA engines giving the most AI TOPS at 30 W max or less
- Neousys rugged box PCs with a 10GbE uplink
- Product supporting the Jetson AGX Xavier Industrial with the most USB ports
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- RTSS-Z1021U supported module with the most CUDA cores and its power envelope